VESTALITE® S curing agent is a high performance solution for sheet molding compound (SMC) material with low VOC when combined with a liquid epoxy resin
DICYANEX® is designed for use as a latent curing agent for epoxy resins with the finest particle size for maximum reactivity
With epoxy-amine-systems based on VESTAMIN® the curing process of epoxy resins could be optimized for fast running production cycles and avoid the usage of styrene/anhydrid technology
For more information about Evonik composite products please our website: Composite Industry Team
Adhesives & Sealants
The short chained polybutadien POLYVEST® is a reactive plasticizer for adhesives, sealants and accustical damping in assembling the body in white, even for oily surfaces.
The HTPB (Hydroxyl-terminated polybutadiene), which is being marketed under the trade name POLYVEST® HT by Evonik is well established as polymeric binder for high quality PU adhesives for automotive head lamps.
VISIOMER® specialty methacrylates are used in reactive 2 component adhesive and sealant formulations.
VESTAGON® provides UV, stone chip, acid rain and brake fluids resistance to automotive powder coatings
VESTANAT® EP-M grades are silanes for curing at elevated temperatures (>80°C).
VESTANAT® aliphatic and cycloaliphatic diisocyanate monomers for light stable PUR resins and elastomers as well as cycloaliphatic polyisocyanates for durable 1K and 2K PUR coatings
The ACEMATT® product family offers treated and untreated precipitated and thermal silica as matting agents.
Wetting & dispersing additives
DYNOL™ superwetter provide good substrate wetting, flow & leveling properties, and surface tension reduction in waterborne coatings.
TEGO® Dispers products are used for wetting and dispersing of pigments and fillers in water- and solventborne or high-solid/solvent-free coatings.
ZETASPERSE® products are pigment wetting and dispersing agents for waterborne coatings.
Ancamine® portofilio covers a wide range of modified aliphatic and cycloaliphatic curing agents with varying pot-life, viscosity, cure speed, and chemical resistance